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Electro-thermal and thermo-mechanical effects are becoming more and more important in power electronic systems as industry seeks to decrease packaging and increase power densities. Therefore the demand for faster and more accurate thermal models is increasing. The improved multi-dimensional electro-thermal IGBT model based on a lumped parameter modelling method using MATLAB software has been documented...
The major cause of power semiconductor devices failure is heat. This is no surprise since industry and commercial applications continually require higher power densities and decreased packaging solutions. The pressure is now concentrated on thermal simulation tools that need to take into account detailed device structures and different physical phenomena/parameters that take place inside the semiconductor...
Electro-thermal and thermo mechanical effects are becoming more and more important in power electronic systems as industry seeks to decrease packaging and increase power densities. Therefore the demand for faster and more accurate thermal models is increasing. This paper proposes an improved electro-thermal IGBT model based on a lumped parameter modelling method. The model was developed using MATLAB...
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