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A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed to make solder bumps on TSVs. With the coining process, the standard deviation of bump heights became 1μm. Fluxing underfill which features an extremely low-weight loss with temperature, has been, also, developed to simplify the chip-to-chip...
The electroplating and screen printing are widely used in the micro-electric industry but they have disadvantages of a complicated series of bumping process, equipments and materials. Furthermore, they are not suitable for the fine pitch bumping technology. To overcome these weak points, a maskless bumping technology using SBM has been developed. Solder Bump Masker (SBM) technology does not need any...
Solder-on-pad (SoP) technology gives the fine-pitch flip chip bonding manufacturability and reliability. For the SoP technology with pitch equal to or less than 150 μm pitch, there are many candidates. The cost-effectiveness will be one of the major criteria determining the industry preference. A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed...
In this paper, we propose the bottom-up electroplating without the additional process to resize the wafer for the fabricating the TSVs. It is also able to be the good solution for the wafer crack because of the vertical shape at the wafer edge after wafer thinning. The TSV process using bottom-up electroplating consists with DRIE, deposition of isolation and barrier layers, Au-to-dielectric bonding...
In this paper, a 3D system in package (SiP) module using through silicon vias (TSV) and novel solder bump maker (SBM) has been presented. The SBM is a paste material which is composed of the solder powder and polymer resin. The polymer resin had the smart properties to eliminate the oxide layers on the solder powder and electrode and to form the solder bumps on the electrodes using the rheological...
Bumping processes like the controlled collapse chip connect new process (C4NP) and the immersion solder bumping process for a fine pitch bumping have the disadvantages of the complicated series of process and the possibility of the reliability problems, respectively. To overcome the weak points of these processes, we developed a novel bumping material based on the rheological behavior of the molten...
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