The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
IC components are exposed to moisture and thermal cycles during chip-package-board assembly and in their end use conditions. Moisture exposure influences the mechanical integrity of silicon backend dielectrics, assembly/packaging materials and packages. Reliability performance under accelerated stresses that simulate use conditions are often a critical factor in choice of materials, processing options...
In this paper, we present extensive breakdown results on our 45nm HK+MG technology. Polarity dependent breakdown and SILC degradation mechanisms have been identified and are attributed gate and substrate injection effects. Processing conditions were optimized to achieve comparable TDDB lifetimes on HK+MG structures at 30% higher E-fields than SiON with a reduction in SILC growth. Extensive long-term...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.