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A moving-magnet-type 2-axis MEMS scanner with a rotation angle detector has been developed. The fabricated MEMS scanner demonstrated a raster scan and 2-axis rotation angles detection with one Hall sensor.
Microelectromechanical system (MEMS) technologies have produced various high-value-added products and devices on the basis of heteroginous integration technology including LSI integration. On the other hand, recent LSI has been miniaturized according to scaling law. LSI has been fabricated by standardized process, and its production requires huge facilities. On the other hand, the principle, structure...
A time-of-flight scanning force microscope (SFM) probe with an ability to switch the measurement mode using the electrostatically switching mechanism is designed, fabricated and demonstrated the performance of it. In order to achieve surface observation and chemical analysis simultaneously for imaging the chemical property of a material surface, this probe can switch the positions of the cantilever...
In this paper, we have proposed, fabricated and characterized a parallel electron beam micro-column with single-stranded carbon nanotube (CNT) filed emitters. The integrated micro-column consists of a self-aligned CNT field emitter array (FEA), and a multi-layered electrostatic Si focusing lens array. In our design, the emitters, gate and electrostatic lens array are electrically isolated, and each...
Micromachining is an extended IC fabrication based on photo-fabrication, deep etching, anodic bonding and other advanced process technologies. This is used to produce MEMS (Micro Electro Mechanical Systems) featuring multi-functions, small size and low cost. Nanostructures such as CNT (Carbon Nano Tube) can be also included in the MEMS by nanomachining. MEMS are used as value added key components...
We report the fabrication of a solenoidal microcoil mould structure based on reactive ion etching (RIE) of 100 mum thick borosilicate glass wafers. For magnetic resonance imaging (MRI), glass has superior properties compared to silicon, e.g. the lower dielectric constant and transparency. Double-side polished substrates are pre-etched in a two step process, and then anodically bonded together to achieve...
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