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Three-dimensional packaging technology, which requires fine pitch and high density of solder bumps, has been developed recently for system-in-package applications. There are several methods being used for solder bumping process for now. As the sphere pitch decreases to below 100 mum, electrodepositing has an advantage over robotic ball placement and screen printing in the cost per ball, according...
This work reports on the wetting behavior of electrolyte in fine pitch Cu/Sn bumping process by electroplating. Three methods containing adding complex wetting agent to electrolyte, plasma treatment to photo-resist and ultrasonic vibration were taken to improve the wettability between electrolyte and related materials. Contact angles of electrolyte containing different amount of complex wetting agent...
We report on the contact process utilizing fritting phenomena between Al electrode and probes made of tin or tin gold alloy. The contact method with low contact force on Al electrodes is required for test probing of LSI for the next generation. The test probes made of tungsten or nickel are suitable for making contact with mechanical breaking of aluminum oxide. However, when these hard probes are...
The feasibility of solid state bonding for low-profiled Sn-3.0Ag-0.5Cu (wt%) solder bumps is confirmed at 25-200degC by thermo-compression bonding (TCB) and surface activated bonding (SAB) in ambient air. 100% bond yield was achieved. The bonding windows of the necessary bonding force and temperature were described. The composite percent on the bonding surfaces was analyzed quantitatively by X-ray...
A flip-chip technology was put into practical use by interconnecting a chip-on-chip (CoC) with several thousands of micro-solder bumps with a diameter of 30 mum. Using this technology, the signal transmission rate between chips became comparable to system on chip (SOC) technology. This success with interconnects owes much to the characterization and control of the surface oxidation behavior of solder...
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