The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The coplanarity of the plastic ball grid array (PBGA) packages is one of important issues related to the package assembly and solder ball reliability. This issue would become more severe, when the size of the packages is getting larger and the temperature of solder reflow getting higher (due to the application of lead-free solders). Recently published results indicated that residual strains (mainly...
Polymeric adhesives are popular in the application to electronic or optoelectronic packaging. Residual strains (stresses) of the adhesives have to be determined and analyzed for better reliability design of the joints or bump joints. The purposes of this study are to quantify residual strains of two adhesives: A (paste type) and B (film type) due to chemical shrinkage, stress relaxation, and thermal-...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.