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Use of lead-free solders such as Sn/Ag/Cu results in exposure of printed circuit boards to higher temperatures during assembly compared with eutectic tin-lead solder. If the thermo-mechanical and electrical properties of the laminate materials get affected by exposure to this higher temperature, that may impact the performance and reliability of the circuit board. Variations, if any, in laminate material...
The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as Sn/Ag/Cu has resulted in higher temperature exposures during assembly compared with traditional eutectic Sn/Pb solders. Variations, if any, in laminate material properties before and after board assembly should be considered in the selection of appropriate laminates. This paper provides guidelines for...
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