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The diffusion phenomenon occurring between copper and indium was investigated by molecular dynamics simulations. The calculations were carried out in various temperatures in aging domain with the use of the commercially available Materials Studio v.6. software. The results showed that the intermetallic compound (IMC) growth followed the parabolic law, which indicated this growth to be mainly controlled...
The increasing requirements for heat dissipation in modern microelectronic devices makes it necessary to develop new materials (e.g. thermal interface materials) with high thermal conductivity. Due to excellent thermal and thermo-mechanical properties some nanomaterials, like carbon nanotubes, are increasingly being used to create new thermally conductive composites. The development of such composites...
In the current paper the influence of dynamics simulation parameters on thermal conductivity of (10,10) CNT at room temperature in ballistic regime was investigated. The parameter were values of kinetic energy used to enforce the heat flux and the time step of simulation in NVE ensemble. As a criterion to evaluate the results the Pearson's coefficient and the standard deviation was adopted. To calculate...
Currently there is a lot of ongoing research towards estimation the thermal conductivity of carbon nanotubes (CNT). In the current paper thermal conductivity of SWNT were studied by using non-equilibrium molecular dynamics (NEMD) simulations (implemented in Materials Studio software, Accelerys Inc.). The NEMD technique is a direct approach which includes the computation of heat transport coefficients...
Current paper focuses on the influence of chiral vector on thermal conductivity of carbon nanotubes. The non-equilibrium molecular dynamic technique was implemented in commercially available software. The eleven single-walled CNTs of various chirality (from zigzag to armchair) was investigated. Moreover, the influence of length on CNTs thermal conductivity was examined.
In the following paper the measurement method of thermal conductivity is described. This method was especially designed for measuring the thermal conductivity of the thermal adhesives. The principal informations about heat transfer are given, and the experimental setup, mathematical model of experiment and its uncertainty with 95% of probability are shown. The thermal conductivity of polymer based...
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