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In this paper an application of Integral Analysis Techniques is demonstrated for determining the effect of large simultaneously switching IC Circuit Groups (internal IC-Circuits and I/O's ) on their Power Integrity (PI) and I/O-Signal Integrity (I/O-SI) behavior. The analysis includes the complex Packaging (CP+PCB). A large u-Controller and its wire-bonded Chip-Package(CP) plus its Test-PCB have been...
The electromagnetic emission of complex very large scale integrated circuits is determined by their operation activity plus the manifold noise propagation paths through the on-chip power routing, the package traces and the planes and traces on the printed circuit board. The design of any emission test board influences the emission finally measured at defined probing connectors. Good simulation models...
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