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A recently proposed rapid prototyping technology for electronic systems, which is based on a WSI active configurable circuit board comprising more than one million contact, can be programmed to interconnect integrated circuit packages deposited on its surface. This technology has some similarities, but also some key distinctive constraints when compared to conventional printed circuit boards. A workflow...
This paper reports on the challenges encountered, and the solutions adopted in the hardware and software co-verification of a wafer-scale integrated (WSI) system. The WaferBoardtrade is designed for rapid prototyping of complex digital systems. This advanced technology embeds a smart active substrate that can be configured through a set of JTAG ports to interconnect digital integrated chips placed...
This paper presents a programmable interconnection network for a novel multi-reticle integrated circuit providing a reconfigurable circuit board for rapid system prototyping. This multi-dimensional mesh grid network, called WaferNettrade, can actively interconnect any pair of pins of integrated circuits deposited on the configurable system board. Two crossbar architectures are implemented and compared,...
This paper introduces an innovative reconfigurable circuit board for rapid system prototyping. This system supports high pin-count packages and high density system integration requirements, and can be programmed to interconnect integrated circuits and other components at near-intra-chip density. This paper presents the concept and investigates several aspects related to its feasibility. Considered...
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