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In this paper, we present the mechanical characterization of high aspect ratio through-wafer electroplated copper interconnects. Copper was deposited in very high aspect ratio (~15) and narrow DRIE etched through-vias (15 mum) in silicon substrate by a special electrodeposition technique. Since the basic understanding of the mechanical and material properties of electroplated copper is very critical...
Failure analysis of lead-free solder joints for PBGA assemblies subjected to thermal cycling aging is reported. A micro-digital image speckle correlation system (Micro-DISC) was employed for micro-deformation and strain analysis. The Sn-3.8Ag-0.7Cu (SAC) soldered assembly was subject to a temperature ramp from room temperature of 25 degC to 125 degC. The growth of interfacial IMC compounds and the...
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