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Thermal management of device-level packaging continues to present many technical challenges in the electronics industry. In a device/heat sink assembly, the highest resistance to heat flow typically comes from the thermal interface material (TIM). The thermal conductivities of TIMs remain in the range of 1-4 W/mK due to the properties and structure of small dispersed solids in polymer matrices. As...
Thermal management of device level packaging continues to present many technical challenges. In the typical chip heat sink assembly, the highest resistance to heat flow comes from the thermal interface material (TIM). The thermal conductivities of TIMs remain in the range of 1-4 W/mK due to the properties and structure of small dispersed solids in polymer matrices. As a result of the rising design...
This paper reports the current status of a novel MEMS based ultra-high density compliant interconnect technology that was proposed in the last Electronic Components and Technology Conference (ECTC). This MEMS-based interconnect, which we call smart three axis compliant (STAC) interconnects are directly fabricated onto electrical contact pads or thru-silicon vias on die at the wafer-level. These interconnects...
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