The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Semi-conductor devices are mostly encapsulated by epoxy molding compound (EMC) materials. During encapsulation stresses are generated due to the curing of the molding compound. Moreover, additional stresses will build up during cooling down from molding to ambient temperature caused by the differences in the coefficient of thermal expansion. These residual stresses add up to the stresses generated...
Warpage is a critical issue for an electronic package molding process. Much work is done in the past to predict the warpage of a package after the cooling down from the molding process. However, there are many material models for the molding compound to predict warpage: Elastic and viscoelastic models are used, and there are even groups which use cure-dependent viscoelastic models. In this paper,...
Warpage is a critical issue for a QFN panel molding process. Much work is done in the past to predict the warpage of a package during cooling down from molding temperature. However, until now, warpage could not always be predicted well, even if the viscoelastic behavior of the molding compound is taken into account. It was for example observed that the cooling velocity affected the warpage after cooling...
The miniaturization of microelectronics has led to the use of polymer dielectric films with a thickness less than a micrometer. The use of polymer dielectric films has introduced new failure modes. To have a better understanding of these failures, knowledge of the mechanical properties is necessary. The through-plane elastic modulus and change in permittivity for a 1 mum thick Cyclotenetrade 4022...
The acceptable flexibility for ultra-thin substrate would be reached by embedding the ultra-thin substrate into the flexible polyimide and patterning the poly-silicon or silicon into square segmentations. In this contribution, results of experiments and FE simulations on mechanical reliability issues of poly- and single crystalline silicon on ultra-thin polyimide substrates are presented. Generation...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.