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A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and reduce the delay of interconnects significantly across the dies. However, a major challenge in 3D technology is the increased power density, which gives rise to the concern of heat dissipation within the processor. High temperatures...
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and high-bandwidth fabric for interconnect design. The advent of the 3D technology has provided further opportunity to reduce on-chip communication delay. However, the design of the 3D NoC topologies has important distinctions...
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and reduce the delay of interconnects across the dies. However, a major challenge in 3D technology is the increased power density which brings the concern of heat dissipation within the processor. High temperatures trigger voltage...
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor's reliability and reduces its lifetime. While hardware level dynamic thermal management (DTM) techniques, such as voltage and frequency scaling, can effectively lower the chip temperature when it surpasses the thermal threshold, they...
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