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The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After addition of nano Ni powder in Sn-based lead-free solders, there was no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn phase was observed...
The aim of this study is to characterize the behaviors of laser-welded joint between pure nickel (Ni200) weld clip and Kovar base metal under various mechanical loadings, i.e. shear and fatigue in shear. A Nd:YAG laser source with 1064 nm was used to weld a Ni200 piece onto a Kovar substrate by single weld spot. These samples were then subjected to shear test. While the shear fatigue cyclic tests...
High current density induced damages such as electromigration in the on-chip interconnection /metallization of Al or Cu has been the subject of intense study over the last 40 years. Recently, because of the increasing trend of miniaturization of the electronic packaging that encloses the chip, electromigration as well as other high current density induced damages are becoming a growing concern for...
Anisotropic conductive films (ACFs) are widely used in the electronic packaging industries because of their fine pitch potential and the assembly process is simpler compared to the soldering process. However, there are still unsolved issues in the volume productions using ACFs. The main reason is that the effects of many factors on the interconnects are not well understood. This work focuses on the...
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