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The performance of a composite spreader, with a 0.4 mm thick top layer of porous graphite (PG), for enhanced cooling with nucleate boiling of FC-72 dielectric liquid, and a 1.6 mm copper (Cu) substrate, for achieving better cooling of underlying 10 X 10 mm computer chip, with a non-uniform surface heat flux, is investigated. This spreader takes an advantage of the enhanced nucleate boiling heat transfer...
Thermal analysis is performed which investigated using a composite spreader for removing the thermal power dissipated by a high power, 10 times 10 mm computer chip with a non-uniform surface heat flux. The composite spreader consists of a 0.4 mm top layer of porous graphite (PG) and a 1.6 mm copper (Cu) substrate. The exposed surface of PG is cooled by saturation or 30 K subcooled boiling of FC-72...
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