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As miniaturization is the permanent pursuit of microelectronic industry, stencil printing technology for flip chip bumping has been contributing to this trend for almost half a century. Nowadays, it's still one of the lowest cost solutions to massive manufacture of IC packaging industry. To meet the requirement of further miniaturization, this paper investigated the realization of fine pitch (about...
NiMoP is one of the most important barrier layers for Cu interconnection. A pretreatment for initiating electroless plating on Si/SiO2 based on palladium ion grains chemisorption on self-assembled monolayers (SAMs) of amidogen of silane coupling agent has been developed. The process and properties of electroless plating NiP/NiMoP compound thin films on Si/SiO2 substrate have been investigated. When...
A novel fabrication process for electroless plating NiMoP barrier layer on SiO2 was presented for 3D packaging with silicon vertical interconnects. The NiMoP film was deposited electrolessly by using a silane coupling agent as an adhesion and catalyzed layer. In addition, a potential NiMoP barrier/seed layer was successfully formed via electroless plating atop SiO2 after Pd activation. The composition...
RF-MEMS is one of the most potential applications for MEMS products. Eutectic solder wafer bonding is one of the attractive methods for RF-MEMS wafer level packaging. A process of gold-tin hermetical wafer bonding was developed in SAIT, Korean. Different UBM systems and thin films of gold-tin were deposited on cap wafer, RF-MEMS device wafer and substrate wafer (if needed). The bonding was performed...
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