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This stud} investigated the interaction of interfacial reactions between Cu/Sn3.5Ag and Sn3.5Ag/AuNi diffusion couples with different stand-off heights (SOH) in immature solder joints. After reflowing. many (Cux,Ni1-x)6Sn5 IMCs were found to surround the original IMCs at both interfaces of the solder joint, which were attributed to Cu and Ni atoms diffusion throughout the w hole solder. This phenomenon...
The effect of interfacial IMCs (intermetallic compounds) proportion on the reliability of miniature lead-free solder joint was studied. The miniature lead free solder joint was formed with Sn-3.5Ag-0.5Cu or Sn-3.5Ag solder alloys and two copper bars that the ends were plated with Ni and Au. Several sizes of micro-joints were gotten to measure the effect of IMCs proportion. Optical microscope (OM)...
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