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The scanning delay line is a key component of time-domain optical coherence tomography systems. It has evolved since its inception towards higher scan rates and simpler implementation. However, existing approaches still suffer from drawbacks in terms of size, cost and complexity, and are therefore not suitable for implementation using integrated optics. In this paper we report a rapid scanning delay...
This paper presents a fabrication process for high-temperature MEMS microhotplates that uses sputtered molybdenum as a conductive material. Molybdenum has a high melting point (2693°C bulk) and is simpler to deposit and pattern in larger series than platinum. Molybdenum is sensitive to oxidation above 300°C, so during fabrication it is protected by PECVD silicon oxide and then covered by LPCVD SiN...
This paper presents a self-cleaning mass calibration procedure for a thermogravimetric (TC) device using molybdenum (Mo). A Mo thin-film is deposited by sputtering and patterned with known geometry on the device sample area using a standard lithography step thus giving accurate control of the mass of the sample under investigation. The device resonance frequency is measured while the temperature of...
We present a new MEMS nanoreactor fully integrated on a single die. It enables atomic-scale imaging of nanostructured materials under the high pressures and temperatures that are typical for many industrial applications (14 bar and 660°C). The reactor can therefore be used to study the behavior of e.g. catalysts in a transmission electron microscope (TEM). It has a shallow channel (0.5 μm), which...
We report a SiC MEMS microhotplate designed for high temperature characterization of nanomaterials in transmission electron microscopes (TEMs). The microhotplate integrates, for the first time, a microheater of doped polycrystalline silicon carbide (poly-SiC) and electron-transparent windows of amorphous SiC (a-SiCx) on a freestanding membrane of undoped poly-SiC. Our work focuses on the development...
This paper presents a MEMS chemical micro-reactor with integrated heat exchanger designed and fabricated by means of wafer level encapsulation techniques like low temperature (400??C) silicon fusion bonding and thin film encapsulation. The fabrication method results in a leak tight reaction cavity under 1 atm pressure difference during operation. Furthermore, the surface micromachining process leads...
In this paper, a study of the effects on both lifetime and resistivity, induced by helium implantation processes, is presented. A wide range of implantation energies (from 3.5 MeV to 5.8 MeV) and doses (from 1middot108 atm/cm2 to 2middot1011 atm/cm2) is considered and, for each of them, the resistivity profile and the lifetime profile are measured and compared with that of the unprocessed material...
In this work we present an experimental study on the effects of helium implantation in silicon. Doses in the range 1 times 1010 - 5 times 1011 atoms/cm2 have been analysed. Results show that, increasing the dose, a saturation effect on the minimum lifetime that can be achieved occurs, while a marked effect on the resistivity of the material appears. The temperature dependence of the resistivity show...
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