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This paper presents a fabrication process for high-temperature MEMS microhotplates that uses sputtered molybdenum as a conductive material. Molybdenum has a high melting point (2693°C, bulk) and is simpler to deposit and pattern in larger series than platinum. Molybdenum is sensitive to oxidation above 300°C, so during fabrication it is protected by PECVD silicon oxide. The electrical resistivity...
This paper presents a fabrication process for high-temperature MEMS microhotplates that uses sputtered molybdenum as a conductive material. Molybdenum has a high melting point (2693°C bulk) and is simpler to deposit and pattern in larger series than platinum. Molybdenum is sensitive to oxidation above 300°C, so during fabrication it is protected by PECVD silicon oxide and then covered by LPCVD SiN...
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