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The effect of five parameters that affect the performance of a liquid cooling module; module orientation, charge ratio, charge temperature and air temperature have been investigated. The liquid cooling module was previously developed by the authors and comprised of an integrated assembly of a boiling plate, spacer, and condenser plate and used FC-72 as the working fluid. The size of the module was...
A liquid cooling module as a cooling means for electronic devices using boiling and condensation heat transfer was designed and its performance was investigated. The liquid cooling module was comprised of a boiling plate, spacer, and condenser plate and used FC-72 as the working fluid. The size of the module was 101 mm times 108 mm times 18 mm and the chip size (heat source) used was 10 mm times 10...
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