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The AC electromigration of multilayered interconnect systems consisting of TiW-AlSiCu and CVD W-AlSiCu is studied under stress of repetitive dual-pulse current waveforms at 2 MHz. By using a general AC waveform in which the peak current density of the first pulse j/sub 1/ is fixed and the second is varied from +j/sub 1/ to -j/sub 1/, a continuous electromigration spectrum from DC through pulsed DC...
The electromigration (EM) performance and failure mechanisms for 1.2- mu m vias fabricated in a passivated Ti:W/Al-Cu(2 wt.%) metallization were investigated. Single van der Pauw via structures were stressed at 175 degrees C and 200 degrees C and at accelerated current densities. The via resistance was monitored independently of the metal feed lines and a difference in activation energy, failure mode,...
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