The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Design for Reliability (DfR) is focused on demand versus capability modeling, where demand is the functionality, env ironmental conditions and timing conditions that the customer needs from the system. Capability is the “as-designed” robustness of the system along with the design requirements specified for the system performance. The goal of the method described in this paper is to apply DfR guidance...
Failure Reporting Analysis and Corrective Action System (FRACAS) process and procedures provide long-term corrective actions and short-term directives that reduce the cost of rework, increase production throughput and reduce lost material. Each failure mode adds a Failure Period (FP) to the normal build operation process cost, involving cost for troubleshooting and rework activities, which increases...
An increase in the number of software programs failing suitability and effectiveness requirements during DoD Initial Operational Test and Evaluation (IOT&E) has resulted in a mandate from the Office of the Secretary of Defense (OSD), Director, Operational Test & Evaluation (DOT&E) to manage software reliability growth within a program's development and...
This paper presents a study of the optimization of the gold plating thickness for the use of both wire bonding and soldered interconnects on a flexible printed circuit board sample module. Wire bondability is typically better, when the gold plating thickness is greater than 30μin.; however, the risk of problems with solder joint embrittlement becomes a concern with thick gold plating. In order to...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.