Search results for: Wen-Bin Young
Advances in Polymer Technology > 37 > 6 > 1722 - 1731
International Journal of Heat and Mass Transfer > 2017 > 115 > PB > 784-792
Microelectronics Reliability > 2015 > 55 > 3-4 > 613-622
Journal of Mechanical Science and Technology > 2015 > 29 > 7 > 2967-2974
Composites Part A > 2013 > 46 > Complete > 19-25
Applied Mathematical Modelling > 2013 > 37 > 3 > 1177-1186
Applied Composite Materials > 2013 > 20 > 6 > 1305-1319
Applied Composite Materials > 2012 > 19 > 3-4 > 247-257
Microelectronics Reliability > 2011 > 51 > 4 > 860-865
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 7 > 1048 - 1053
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 12 > 2033 - 2037
International Communications in Heat and Mass Transfer > 2010 > 37 > 10 > 1477-1486
Microelectronics Reliability > 2010 > 50 > 7 > 995-999
IEEE Transactions on Electronics Packaging Manufacturing > 2010 > 33 > 2 > 122 - 128
Microsystem Technologies > 2010 > 16 > 6 > 941-946
Microelectronics Reliability > 2009 > 49 > 12 > 1555-1562
Applied Mathematical Modelling > 2009 > 33 > 9 > 3746-3755
Applied Mathematical Modelling > 2007 > 31 > 9 > 1798-1806