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The topics of 3D-IC packages are now widely studied around the world in recent years, not only in electronic packaging areas, but also in bioengineering areas and so on. With the developments of 3D-ICs technologies, packaging effects on 3D-ICs of Cu/low-k interconnects have become a critical reliability issue, especially in the assembly processes and reliability test procedures. In 3D-IC packages,...
A high Q on-chip spiral inductor has been fabricated by 0.13μm CMOS copper technology with air gap structure. The copper wires were capped with electroless Ni plating to prevent the copper from oxidizing. A Si 3 N 4 /SiO 2 X-beam was designed to increase the mechanical strength of the inductor in air gap. The enhancement of maximum mechanical strength (MMS) of a spiral inductor...
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