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The solid phase diffusion reaction behavior between Ti and Al was characterized from 520 °C to 630 °C for different annealing time with titanium and aluminum being superfluous. When the samples are annealed up to 46 h, only intermetallic TiAl3 phase forms and grows at the Ti/Al interface. It can be found that the growth rate of TiAl3 towards TiAl3/Al interface is more rapid than that towards Ti/TiAl...