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The deflection of gold wire bonds during the encapsulation of IC packaging can seriously cause wire crossover and shorting. Up to now, there is no (standard) algorithm has been proposed to decide the better bond looping system for optimal adjusting the parameters of wire bonder to obtain lower deflection of wire bond. The wire sweep experiment is developed to define the sweep stiffness of wire bond...
To drive the speed of spindle faster and faster, especially for micro-via-drilling, the gas bearing-spindle is a must. However, most investigations of the dynamic characteristics of the spindle system are limited to the ball bearing type of spindle. This work examines the dynamic instability of a rotating spindle system with various bearings to elucidate the difference between the ball and gas bearing-spindle...
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