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As the size of microbumps continues to shrink, the amount of solder decreases gradually, resulting the brittleness of solder joints due to formation of intermetallic compounds. Low-temperature Cu-to-Cu direct bonding appears to be one of the solutions for fine-pitch microbumps for 3D IC packaging. However, the high bonding temperature and pressure are the main problems of this approach. We achieve...
We achieve low-temperature Cu-to-Cu direct bonding using highly (111)-orientated Cu films. The bonding temperature can be lowered to 200°C at a stress of 114psi for 30min at 10 −3 torr. The temperature is lower than the reflow temperature of 250°C for Pb-free solders. Our breakthrough is based on the finding that the Cu (111) surface diffusivity is the fastest among all the planes of Cu and...
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