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For the first time, the dielectric fuse breakdown has been observed in HKMG and poly-Si CMOS devices. It was found that, different from the conventional anti-fuse dielectric breakdown, such as the hard and soft breakdowns, this new fuse-breakdown behavior exhibits a typical property of an open gate and can be operated in much lower programming current (< 50μA), fast speed (∼20μsec), and excellent...
In this paper, the evolution of BTI induced leakage paths has been evaluated by Ig-RTN technique and demonstrated on HK/MG CMOS devices. First, RTN measurement has been elaborated to identify the location of traps and their correlation to the leakage current. Then, the measured gate current transient can be used to analyze the formation of breakdown path. The results show that the evolution of leakage...
For the first time, the breakdown path induced by BTI stress can be traced from the RTN measurement. It was demonstrated on advanced high-k metal gate CMOS devices. RTN traps in the dielectric layers can be labeled as a pointer to trace the breakdown path. It was found that breakdown path tends to grow from the interface of HK/IL or IL/Si which is the most defective region. Two types of breakdown...
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