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The objective of this study is to obtain experimental failure models governing solder joint failure during drop impact testing of board assemblies. A high-speed bend test was developed to perform displacement-controlled bend test of board assemblies at the high flexing frequencies of drop impact. These test frequencies and amplitudes are not achievable by conventional universal testers. Experimental...
This study performs experimental tracking of crack propagation (stage II fatigue) in a single solder interconnection during drop impact. A high resolution, highspeed four-point resistance measurement system is used for tracking crack progression. Results indicate that most of the drop impact low-cycle fatigue life of the solder joint is spent in the crack initiation stage. Cross-sections and fractographs...
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