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Thermomechanical modeling for interconnects and electronic packages is a difficult challenge, especially for material interfaces and films under 1 ??m dimension. Understanding and prediction of their mechanical failure require the simulation of material behavior in the presence of multiple length scales. However, the classical continuum theory is not capable of predicting failure without a posterior...
Finite element method and peridynamic theory are coupled via submodeling approach to investigate the dynamic response and damage in an electronic package subjected to impact loading arising from drop-shock. The global modeling is performed using the finite element method while the peridynamic theory is employed for the submodeling and failure prediction. The analysis yielded the outermost solder joint...
This study presents an application of the peridynamic theory to investigate failure propagation in a multi-layer thin- film structure of electronic packages. A brief description of this non-local theory is presented prior to the statement of the problem. The mathematical description of the theory and its validation by considering a well-known dynamic fracture problem are discussed subsequently. Finally,...
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