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When junction temperatures of the light emitting diode (LED) chips packaged inside LED lamps exceed their maximal limits, the optical extraction and the reliability/durability of the LED lamps will be jeopardized, therefore, thermal management is very important for high power LED street lamps. In this research, a design and optimization method of horizontally-located plate fin heat sink was presented...
Light emitting diode (LED) street lamp heavily relies on successful thermal management, which strongly affects the optical extraction and the reliability/durability of the LED lamp. In this study, a thermal resistance network model was presented to estimate the maximum heat sink temperature of the street lamp, which could be utilized to further evaluate the thermal performance of the street lamp....
Thermal management of a super computer is one key point in the whole system design. The working temperature of electronic device in the super computer is the important parameter to show the cooling performance. Thermal design was conducted for one super computer. The experiment was conducted to test the temperature of an ultrascalable computing platform in order to evaluate the cooling performance,...
In this paper, a microjet-based cooling system is proposed for the thermal management of high-power light-emitting diodes (LEDs). Preliminary experimental investigation and numerical simulation on such an active cooling system are conducted. In the experiment investigation, thermocouples are packaged with LED chips to measure the temperature and evaluate the cooling performance of the proposed system...
In this paper, a micro jet based cooling system for the thermal management of high power LEDs is briefly introduced. Our experiments have demonstrated that the optimization on micro jet device is strongly needed for improving the system performance. To realize the above attempt, numerical optimization on micro jet device is conducted in details in this paper. The comparison between simulation and...
The efficiency and reliability of solid-state lighting devices strongly depend on successful thermal management. High-brightness light emitting diodes (LEDs), as a strong candidate for the next generation general illumination applications, were developed by improving luminous efficiency and integrating multi-chips within limited areas. One of key problems is cooling in developing high power LED for...
Advancement in high heat thermal management technology and its successful integration into emerging GaN-based amplifiers is imperative to meet the long-term requirement of future X-band radar systems. It is also known that the efficiency and reliability of light emitting diode (LED) strongly rely on successful thermal management due to its inherit low junction temperature in the LED chip. In this...
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