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A feasibility study of 70 nm pitch 2-level dual damascene interconnects featuring EUV lithography is presented. Using Ru barrier metal and scalable porous silica (Po-SiO, k=2.1), a low resistivity below 4.5 ????cm and a 13% reduction in wiring capacitance compared with porous SiOC (k=2.65) was obtained. The predicted circuit-performance using Po-SiO was 10% higher than that with porous SiOC. The electromigration...
A comprehensive study of low-k/Cu integration featuring short TAT (turnaround time) silylated scalable porous silica (Po-SiO, k=2.1) with high porosity (50%) is presented. The TAT for silylation is about 25% reduced by adding a promoter, causing reinforcement of the film. Applying this improved Po-SiO, 140 nm pitch dual damascene structure is successfully achieved. The wiring capacitance showed 10%...
Adhesion tests for a real Cu/low-k patterned structure were studied for 45-nm node devices. Results from 4 point-bending (4PB) and modified edge lift-off tests (m-ELT) were compared. Cu dual damascene interconnects structures with stacked hybrid low-k which is porous-poly-arylene(p-PAr)/porous-SiOC(p-SiOC) (k=2.3/2.3) were evaluated. Peel-off occurred in different locations in the real patterned structures...
A key technology for realizing an effective k-value (keff) required for 45nm node is proposed. We studied the behavior of effective dielectric constant derived from capacitance of double-level copper interconnect wires with porous low-k material in detail. The porous low-k materials easily absorb moisture due to process damage and the dielectric constant drastically increases. We have confirmed that...
Moisture induced via failure (MIVF) is studied for 45nm interconnect technology using porous low-k films. Test patterns are designed to examine the layout dependence of the MIVF. Some fundamental and important layout dependencies of the via resistance increase are investigated and considered for the first time. It has been found that the MIVF has not been suppressed, even though multiple vias structure...
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