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This paper presents our recent studies on CMOS front-end circuits for high speed optical links. The circuit topologies of both transimpedance amplifier (TIA) and modulator driver (MD) are discussed for achieving wideband operation in PAM-4 modulation using advanced CMOS technology. Also, issues of integration of the circuits with silicon photonic devices such as the Ge-on-Si photo diode (PD) and silicon...
We demonstrate an optical receiver front-end using a CMOS TIA with a germanium-on-silicon PD. The amplifier only occupies 0.09 mm2 with 12 mW power consumption, and achieves a 27.5 GHz 3-dB bandwidth. The integrated silicon-based receiver shows well opened eye diagrams up to 20 Gb/s.
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