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This paper will focus on the fast assessment methodology of FBGA fatigue life through simulation and physics of failure (PoF) analysis under thermal cycle. The structure of fine pitch ball grid array (FBGA) that has been investigated, and been modeled by ANSYS to compare with experimental data. There are two temperature cycling will be used, one is used to verify FEA model, and the other one is used...
In the multilayered printed circuit board (PCB), the signal transmission between different layers occurs by way of through hole structure. The geometry of a through hole consists of traces, pads and a perfectly conducting hollow cylinder. Conductive Anodic Filament (CAF) generated easily in PCB when board size is decreased. CAF produced will lead to leakages or short circuit. Many reasons cause the...
The effect of the adhesive thickness on the stress distribution in the mid-bondline of the adhesively-bonded steel/steel butt joint under impact loading is analyzed using finite element method (FEM). The results show that the stress distributed in bondline near the interface was significantly affected by the adhesive thickness. When the adhesive thickness increased from 0.2 mm to 0.8 mm, the peak...
Stiction is a major failure mode of MEMS as microscopic structures tend to adhere to each other when their surfaces enter into contact. Although increasing the restoring forces of switch devices could overcome the stiction effect, this is not practical, as in turn, it also increases the actuation voltage. Therefore stiction prediction is important to be considered when designing micro- and nano- devices...
Ball grid array (BGA) packages are a relatively package type and have rapidly become the package style of choice. Much high density, high I/O count semiconductor devices are now only offered in this package style. Designers are naturally concerned about the robustness of BGA packages in a vibration environment when their experience base is with products using more traditional compliant gull or J leaded...
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