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Electronic units that operate in outdoor environments, such as printed circuit board assemblies (PCBA) in telecom, automotive, industrial, and aerospace applications, can experience a significant amount of humidity exposure over their lifetimes, which might exposes the PCBA to be susceptible to dendritic growth and electrical leakage during operation. However, even in the encapsulated PCBAs operated...
In this study, effect of various moisture condition on underfill interfacial adhesion loss were examined using C-SAM, 4-point flexural bend test, and cross sectional analysis. In addition, weight gain analysis was used to determine packages moisture absorption at preconditioning level. In order to understand mechanical properties degradation of underfill material, 4-point flexural bending test was...
In this paper, the failure mode and solder bump strength for low-k flip chip devices were determined using die pull technique. The results show there is no significant difference between low-k and non low-k devices in terms of bumps strength for the amount of taffy in this device. However, there is different in failure mode which shows an increasing in VRO and SRO failure mode. Die pull test within...
The objective of this research is to study electrical overstress (EOS) defect at gate oxide for various pulse widths in n-channel power metal-oxide-semiconductor field effect transistor (MOSFET). Moreover, this research also intent to develop power failure model for n-channel power MOSFET according to Tasca method. Electrical overstress does not have EOS standards and quantitative EOS design objectives...
Solder joining is one of the interconnection methods in microelectronic packaging. The robustness of the solder ball attachment to the packages determines the solder joint strength between solders and the under-bump metallization (UBM). This paper discussed the solder joint shear strength between Sn/4.0/0.5Cu with containing 20-50 ppm phosporus and Sn/3.8Ag/0.7Cu deposited onto selective plating Ni/Au...
For persistent and guaranteed quality of service (QoS), a book-ahead (BA) call connection is required to declare its exact lifetime in advance, which is not always possible for many BA applications. In this letter, we present a model for extendable BA lifetime through adoption of a new BA routing scheme based on the calculation of call extension failure probability of BA call(s) for each link in the...
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