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Particles in the nano-meter size range present extraordinary properties, such as, large surface area per unit volume, large surface energy, low melting point, supermagnetism, self-purification and quantum size effects. These properties have attracted the attention of scientific and technological communities al over the world.In the area of electronics production, one major disadvantage of conventional...
The interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Au/electroless Ni(P)/Cu substrate were investigated after reflow soldering at 260degC for 2 minutes. Common Sn-4.0Ag-0.5Cu and eutectic Sn-0.7Cu solders were used as reference. Two types of intermetallic compounds (IMC) were found in the solder matrix of the Sn-0.4Co-0.7Cu alloy, namely coarser CoSn2 and finer Cu6 Sn5 particles,...
Low-cycle isothermal mechanical fatigue testing of bulk solders and solder joints of eutectic Sn–37wt% Pb, Sn–3.5wt% Ag and Sn–4.0wt% Ag–0.5wt% Cu were carried out at room temperature over a wide range of strains (1–10%). The fatigue results of both bulk and solder joints were compared; the eutectic Sn–37wt% Pb was used as reference. Concerning bulk solders and solder joints, the two lead-free solders...
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