The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A novel low-temperature Cu–Cu bonding approach called the insertion bonding technique has been developed. This technique hinges on the introduction of a tangential pressure at the metal–metal interface, which leads to a high localized plastic deformation that is essential for bond formation. Through finite element modeling studies, it is observed that the insertion bonding technique results in a significantly...
A novel low temperature Cu-Cu bonding approach called the insertion bonding technique has been developed. This technique leverages on the initiation of high shear stresses at metal-metal contact interface, thus resulting in high plastic deformation, which is essential for strong bond formation. Through finite element studies, it is observed that the insertion bonding technique result in significantly...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.