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In three-dimensional integrated circuits (3DICs), aggressive wafer-thinning can lead to large thermal gradients. It is crucial to understand the interaction between process parameters, such as wafer thickness, and the temperature profile in order to design high-performance 3DICs. In this paper we examine how the temperature profile of a single TSV bus driver/receiver is impacted by die thinning. Die...
In three-dimensional integrated circuits (3DICs), aggressive wafer-thinning can lead to large spikes in individual device temperatures. These “hotspots” must be carefully analyzed at design time to ensure that the device temperatures will not cause the circuit to malfunction, and to assess the device temperature's impact on the longevity of the circuit. In this paper we present a tool flow for capturing...
3-D Multi-Chip stacking is a promising technology to overcome the “memory wall”, “power wall”, “ILP wall”, and “utilization wall”. However, a chip to be stacked should be low-power enough to avoid heat issue. On the other hand, such system can benefit from its scalability, flexibility, short time-to-market, especially wide and short latency chip interconnect drives changes on microprocessor architecture...
3D multi-chip stacking is a promising technology poised to help combat the “memory wall” and the “power wall” in future multi-core processors. However, as technology scales and the chip sizes increase due to the number of transistors, interconnects have become a major performance bottleneck and a major source of power consumption for microprocessors. In this article, we introduce a TSV-based ultra-wide...
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