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We studied submicrometer (LG = 0.15-0.25 ??m) gate-recessed InAlN/AlN/GaN high-electron mobility transistors (HEMTs) on SiC substrates with 25-nm Al2O3 passivation. The combination of a low-damage gate-recess technology and the low sheet resistance of the InAlN/AlN/GaN structure resulted in HEMTs with a maximum dc output current density of IDS,max = 1.5 A/mm and a record peak extrinsic transconductance...
With the DARPA Wide Bandgap Semiconductor Technology RF Thrust Contract, TriQuint Semiconductor and its partners, BAE Systems, Lockheed Martin, IQE-RF, II-VI, Nitronex, M.I.T., and R.P.I, are achieving great progress towards the overall goal of making gallium nitride a revolutionary RF technology ready to be inserted in defense and commercial applications. Performance and reliability are two critical...
This letter is a first report on the operation of AlGaN/GaN high-electron mobility transistors (HEMTs) atomically attached to a CVD diamond substrate. This technology demonstration shows the feasibility of producing GaN based devices on polycrystalline CVD diamond substrates to maximize heat extraction from devices operating at high power by situating the diamond substrates in the immediate proximity...
A comparison of RF reliability at 10 GHz on four different undoped AlGaN/GaN HEMT structures with AlGaN barrier thickness variation is presented. The output power degradation characteristics during RF stress for each structure are shown, and the results indicate a strong dependence of reliability on AlGaN thickness. A device from the structure with the thinnest AlGaN in the study, with initial output...
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