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A hindered phenol antioxidant with rigid para‐bridged group (antioxidant AP) was synthesized to study the effect of the chemical structure on the antioxidant properties of hindered phenol antioxidants in high density polyethylene (HDPE). Antioxidant behavior of series of hindered phenol antioxidants with different para‐bridged groups in HDPE resin was also investigated by the thermal oxidation experiment,...
Interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Ni/Cu substrate have been investigated after reflow and high temperature storage. The reflow peak temperature at 265degC and a total duration time of 6 minutes were used. The duration time at the peak temperature of the reflow process was approximately 2 min. The aging temperature was 150degC and the duration time was 100 h,...
The Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-immersion Au metallization exhibited different interfacial morphology after high temperature storage (HTS) testing at 150degC. Ni3Sn4 intermetallic compounds (IMCs) were found in the Sn-Ag system, while in the Sn-Ag-Cu system, spalling grains of (Cu,Ni)6Sn5 IMC were observed after long aging, along with a thick (Ni,Cu)3Sn4 IMC layer which adheres...
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