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Three-dimensional solenoids have been developed and demonstrated for the first time in stacking of through-silicon via chips. High-density microcoils ( width, space, and depth with 24 turns) were completely filled with Cu. Eight high-density microcoil chips were stacked using a conductive...
3D integration by TSV approach is a very hot topic now as an enabling technology for 3D wafer-level packaging and 3D IC. Re-distribution layer (RDL) process becomes more critical on high volume Cu (TSV) wafer because of Cu thermal stress effect. Fine pitch low temperature RDL is required in 3D packaging and 3D IC integration. We develop fine pitch (5μm space/5μm width) single and dual damascene processes...
3D integration by TSV approach is a very hot topic now as an enabling technology for 3D wafer-level packaging and 3D IC. Re-distribution layer (RDL) process becomes more critical on high volume Cu (TSV) wafer because of Cu thermal stress effect. Fine pitch low temperature RDL is required in 3D packaging and 3D IC integration. We develop fine pitch (5µm space/5µm width) single and dual damascene processes...
Limited battery power for wireless devices demands improvement in power efficiency while enhancing system performance. Traditional semiconductor scaling faces challenges to meet this requirement. 3D integration of multiple chips using through silicon via (TSV) is one of the technologies that can extend the performance scaling trend. However, the semiconductor industry will need to overcome many technology...
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