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The aim of this study is to optimize the bond process for Cu/Sn wafer-level bonding, a competitive material for modern MEMS encapsulation due to its low cost and high performance. For this Solid-Liquid Interdiffusion (SLID) bonding technique, it is important to understand the formation of the intermetallic compounds (IMCs), which takes place during the bond process. In order to estimate thermodynamic...
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