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Through-silicon-via (TSV) technology has been employed for three-dimensional (3D) packaging of multi-chips. A high interwafer interconnect density can be achieved with a minor area penalty. Having shorter signal paths between dies make it possible to improve the system's performance by permitting the system to run faster, alleviate interconnect delay problems, it also consumes less power. Copper has...
The design and fabrication of a novel 2-D wind sensor as well as the interface circuits and test results were presented in this paper. A novel constant temperature difference (CTD) mode control circuits with thermal feedback was proposed, and full bridge circuits were used for wind measurement. It was fabricated on the ceramic substrate, and direct chip attach (DCA) packaged to the substrate. The...
A two dimensional wind sensor was designed, fabricated and packaged on ceramic substrate instead of silicon substrate. The Ti/Pt heater and thermistors were fabricated using single lift-off process. The gold bumps were then sputtered and patterned on the chip using lift-off process again. Correspondingly, the Pb/Sn bumps were fabricated on the FR4 substrate using stencil printing method after metallization...
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