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In this paper, an innovative 1D technology is used to model complex vias structures in 3D IC and package system, which can include the layout of both eccentric single-ended and differential signaling types. The problem under investigation is an essential basic unit which can be applied to build and model complex multilayer structures. We first obtain the impedance matrix for finite cavity, which includes...
In this paper, a new efficient methodology is used to model dense via arrays in 3D integrated circuit and package system, which also can include the layout of multiple vias sharing the same antipad. In order to accurately calculate all the effects of high order waveguide modes and azimuthal modes for complete signal integrity analysis of multiple closely spaced vias, we make use of transformation...
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