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Most used polymers show a visco-elastic behaviour. The significant change of the material properties is a function of time and temperature, and needs to be taken into consideration. When exposed to humid environments, epoxy resins can absorb water up to a 10 weight -%, depending on the chemical nature and structure, stress state, exposure time, water concentration and temperature. The use of temperature...
This paper addresses the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins. This is an important topic within a multi-scale framework to lifetime prediction in electronic packaging. For that purpose, epoxy-resins with small systematic variations in chemical structure have been synthesised and then characterised by various thermo-mechanical testing methods...
In this paper the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins is discussed. This is a topic relevant for a multi-scale framework to lifetime prediction in microelectronics packaging. To achieve that objective, epoxy-resins are synthesised by systematically varying their chemical structure and then characterised by various thermo-mechanical testing...
Interfacial adhesion between the Epoxy Molding Compound (EMC) and the copper-based leadframe is one of the major concerns in the qualification of plastic packages. Since the conventional shear testing methods used in industry do not consider the residual stresses in the shear samples, they are only used as a qualitative testing method for the EMC qualifications. However, since these tests are based...
The use of temperature and time dependent material parameters is state-of-the-art in mechanical engineering. An advanced measurement method for the determination of moisture dependent parameters for micro and nano scale samples was developed. In combination with FE-analysis, this tool (involving time, temperature, and humidity) ensures a sure deployability. The present paper deals with the influence...
We made a structure property correlation (SPC) by altering systematically the chemistry of a cross-linked epoxy resin and examining the material behaviour and failure mechanisms under the external influence of moisture, temperature and stress. The epoxy resin (aromatic epoxy: 1,3-Bis-(2,3-epoxypropyl)-benzene and amine hardener: 1,2-Diaminoethan ) was examined under different loading conditions (65degC/75rh,...
The properties of epoxy based materials alter, when exposed to humid environment and temperature. To better understand the failure mechanisms on microelectronic packaging we examine these epoxies (aromatic epoxy: l,3-Bis-(2,3-epoxypropyl)-benzene and amine hardener: 1,2-Diaminoethan ) under different initial conditions of temperature (300-400 K) & humidity (85,100 RH) and change systematically...
The universal applicability of polymeric materials in microsystem technology is based on a wide adaptability of their thermo-mechanical as well as their electric/dielectric characteristics. However, as they are generally sensitive to temperature and moisture, obey a misfit in thermal expansion to other electronic materials, and lack a high mechanical strength they are often the weakest link in packaging...
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