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A widely used application of the atomic layer deposition (ALD) and chemical vapour deposition (CVD) methods is the preparation of permeation barrier layers against water vapour. Especially in the field of organic electronics, these films are highly demanded as such devices are very sensitive to moisture and oxygen. In this work, multilayers of aluminium oxide (AlO x) and plasma polymer (PP) were...
We report on the continuous increase of the breakdown electric field, also known as disruptive strength, of an ultra thin layer based on Al 2 O 3 prepared by low temperature atomic layer deposition (ALD) by reducing its thickness down to 3nm. By measuring the disruptive strength for lower thicknesses, we demonstrate that these observations are in agreement with recent reports. Furthermore...
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