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In digital signal processing, it is difficult to achieve flexible arbitrary sampling rate conversion. As for this problem, a new algorithm is proposed to realize arbitrary variable up-sampling based on lookup table. The algorithm firstly constructs an original filter whose coefficients are stored in ROMs. Then the target filter is decimated from lookup table by mapping sampling rate as addressed....
With the rapid development of Internet technology, information resources on the Internet become more abundant, but also bring some problems like diversity, heterogeneity, disorder, and redundancy. Given a brief expression like search keywords only, users' needs are ambiguous. Therefore, current technologies of search applications relying on direct keyword matching cannot meet the requirements of users...
In the new rural programming and construction advancement, it needs protecting the unique nature landscape of rural settlement, and probing into its evolvement and development medel. By analysis the status quo of traditional rural settelment and point out its existing problems afterward, expounding objective and significant of protecting and updating traditional rural settelment, then point out the...
This paper addresses the problem of peak to average power ratio (PAPR) reduction in multi-band transmitters by PTS approaches. In the conventional PTS approaches, the computational complexity is high and need to transmit side information, which is hard for hardware implementation. Aiming at the problems, a PTS algorithm which using gray code to reduce the complexity is proposed. The MATLAB simulation...
A filament-assisted chemical vapor deposition (FACVD) concept for back-end-of-line (BEOL) applications is presented. Key capabilities of this technology include low-temperature plasma-free film deposition with straightforward scalability and extendibility. Deposition mechanism and film properties are compared with conventional plasma-enhanced CVD (PECVD). FACVD deposition of a decomposable polymer...
The mechanical stability of air-gap interconnect structures during thermal processing and under chip packaging interaction (CPI) were investigated using 3D multilevel finite element analysis (FEA) models. Low k cap delamination from the Cu barrier during thermal processing, channel cracking of the bridging cap and dielectric overlayers, and interface delamination under packaging were identified as...
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