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3D stacking of dies is a promising technique to allow miniaturization and performance enhancement of electronic systems. Key technologies for realizing 3D interconnect schemes are the realization of vertical connections, either through the Si-die or through the multilayer interconnections. The major bottleneck for 3D integration are thermal management issues due to the reduced thermal spreading in...
This paper presents a new generic methodology used to determine a parameterized compact thermal model for 3-D stacked integrated circuits (3D-SIC). The method allows to calculate the thermal distribution due to hot spots in the die stack. This approach is applied to different case studies of stacked dies configurations. In order to demonstrate the method, a fully generic non-uniform heat sources ??grid??...
3D integration architectures for microelectronic circuits have attracted much interest in the recent past, due to their capabilities for more efficient device integration and faster circuit operation. This type of assembly is formed by bonding multiple active layers through a dielectric material, and employs through-silicon vias for electrical interconnection. In this work we present the thermal analysis...
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