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Carbon nanofiber (CNF) is promising as a next-generation on-chip interconnect material. Understanding the temperature dependence of CNF resistance is important in evaluating its potential for such interconnect applications. In a CNF test device, contacts formed by tungsten (W) deposition using focused ion beam (FIB) is effective in minimizing the effect of unwanted parasitics, thus yielding a more...
Carbon nanofibers (CNF) are studied in a horizontal configuration as a model for on-chip interconnects. The electrical performance is determined by both CNF resistivity and contact resistance with electrodes. Reliability and current capacity are determined by Joule heating in the system and the thermal accompanying transport. We show that current capacity can be modeled by accounting for the nature...
In a carbon nanofiber (CNF) metal contact such as a bridge between two metallic electrodes, passing high current (current stressing) reduces the total resistance of the system (CNF resistance RCNF and contact resistance Rc) by orders of magnitude. The role of current stressing is modeled as a reduction in the interfacial tunneling gap with transport characteristics attributed to tunneling between...
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